High adhesive strength Ni-P thin film on ZnS by an electroless deposition process

Naoki Okamoto, Megumi Miyamoto, Takeyasu Saito, Kazuo Kondo, Takafumi Fukumoto, masaki Hirota

研究成果: ジャーナルへの寄稿学術誌査読

1 被引用数 (Scopus)

抄録

Zinc sulfide (ZnS) and its related materials are important materials for UV light emitting diodes, flat panel displays, and IR windows. To utilize these optoelectronic devices for electronic products, it is necessary to make electric circuits or signal lines on the ZnS substrate. However, the films made by conventional processes have weak adhesive strength. To overcome this limitation, we developed an electroless deposition process to make nickel-phosphorus (Ni-P) film. The films made using our process showed high adhesive strength in tensile tests and were also of very uniform thickness.

本文言語英語
ジャーナルElectrochemical and Solid-State Letters
13
6
DOI
出版ステータス出版済み - 4月 27 2010
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 電気化学
  • 電子工学および電気工学
  • 材料科学(全般)
  • 化学工学(全般)
  • 物理化学および理論化学

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