High Performance Coated Conductors Fabricated by UTOC-MOD Process

Teruo Izumi, Koichi Nakaoka, Michio Sato, Takato MacHi, Akira Ibi, Ryuji Yoshida, Takeharu Kato, Masashi Miura, Takanobu Kiss, Masayoshi Inoue

研究成果: ジャーナルへの寄稿記事

抄録

A new metal organic deposition (MOD) process using precursor solution containing metal trifluoroacetates was developed to improve in-field performance. In this process, the pinning centers of BaMO3 (M: metal elements such as Zr and Hf) materials could be made to be finer by reducing the once coating thickness in the coating and calcination step. This is referred to as the ultra-thin once coating (UTOC)-MOD process. This process improves the in-field performance. The UTOC-MOD process also has the advantage of uniformity of 2-dimensional Jc-distribution, which was determined using a scanning hall-probe microscopy analysis. Improvement of the Jc uniformity was also confirmed based on scribed tapes. A smaller dispersion of the filament-critical current values in the UTOC-MOD tape was determined based on a comparison with the results for obtained by a conventional process. With respect to the mechanical strength, it was established that the dispersion of the delamination strength, which was evaluated using stud-pull equipment, was suppressed. Microstructural analysis revealed that, the UTOC films were pore-free, although large pores are present in the films when conventional MOD is utilized. This difference in the microstructure can be attributed to the aforementioned improvement in the uniformity of the UTOC-MOD films.

元の言語英語
記事番号8710275
ジャーナルIEEE Transactions on Applied Superconductivity
29
発行部数5
DOI
出版物ステータス出版済み - 8 1 2019

Fingerprint

metal coatings
Metal coatings
conductors
Metals
coatings
Coatings
metals
Tapes
tapes
porosity
Trifluoroacetic Acid
Critical currents
Delamination
Chemical elements
Calcination
roasting
Strength of materials
critical current
filaments
Microscopic examination

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

これを引用

Izumi, T., Nakaoka, K., Sato, M., MacHi, T., Ibi, A., Yoshida, R., ... Inoue, M. (2019). High Performance Coated Conductors Fabricated by UTOC-MOD Process. IEEE Transactions on Applied Superconductivity, 29(5), [8710275]. https://doi.org/10.1109/TASC.2019.2908241

High Performance Coated Conductors Fabricated by UTOC-MOD Process. / Izumi, Teruo; Nakaoka, Koichi; Sato, Michio; MacHi, Takato; Ibi, Akira; Yoshida, Ryuji; Kato, Takeharu; Miura, Masashi; Kiss, Takanobu; Inoue, Masayoshi.

:: IEEE Transactions on Applied Superconductivity, 巻 29, 番号 5, 8710275, 01.08.2019.

研究成果: ジャーナルへの寄稿記事

Izumi, T, Nakaoka, K, Sato, M, MacHi, T, Ibi, A, Yoshida, R, Kato, T, Miura, M, Kiss, T & Inoue, M 2019, 'High Performance Coated Conductors Fabricated by UTOC-MOD Process', IEEE Transactions on Applied Superconductivity, 巻. 29, 番号 5, 8710275. https://doi.org/10.1109/TASC.2019.2908241
Izumi, Teruo ; Nakaoka, Koichi ; Sato, Michio ; MacHi, Takato ; Ibi, Akira ; Yoshida, Ryuji ; Kato, Takeharu ; Miura, Masashi ; Kiss, Takanobu ; Inoue, Masayoshi. / High Performance Coated Conductors Fabricated by UTOC-MOD Process. :: IEEE Transactions on Applied Superconductivity. 2019 ; 巻 29, 番号 5.
@article{33346c78fe854d51bd016372d46f3adf,
title = "High Performance Coated Conductors Fabricated by UTOC-MOD Process",
abstract = "A new metal organic deposition (MOD) process using precursor solution containing metal trifluoroacetates was developed to improve in-field performance. In this process, the pinning centers of BaMO3 (M: metal elements such as Zr and Hf) materials could be made to be finer by reducing the once coating thickness in the coating and calcination step. This is referred to as the ultra-thin once coating (UTOC)-MOD process. This process improves the in-field performance. The UTOC-MOD process also has the advantage of uniformity of 2-dimensional Jc-distribution, which was determined using a scanning hall-probe microscopy analysis. Improvement of the Jc uniformity was also confirmed based on scribed tapes. A smaller dispersion of the filament-critical current values in the UTOC-MOD tape was determined based on a comparison with the results for obtained by a conventional process. With respect to the mechanical strength, it was established that the dispersion of the delamination strength, which was evaluated using stud-pull equipment, was suppressed. Microstructural analysis revealed that, the UTOC films were pore-free, although large pores are present in the films when conventional MOD is utilized. This difference in the microstructure can be attributed to the aforementioned improvement in the uniformity of the UTOC-MOD films.",
author = "Teruo Izumi and Koichi Nakaoka and Michio Sato and Takato MacHi and Akira Ibi and Ryuji Yoshida and Takeharu Kato and Masashi Miura and Takanobu Kiss and Masayoshi Inoue",
year = "2019",
month = "8",
day = "1",
doi = "10.1109/TASC.2019.2908241",
language = "English",
volume = "29",
journal = "IEEE Transactions on Applied Superconductivity",
issn = "1051-8223",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "5",

}

TY - JOUR

T1 - High Performance Coated Conductors Fabricated by UTOC-MOD Process

AU - Izumi, Teruo

AU - Nakaoka, Koichi

AU - Sato, Michio

AU - MacHi, Takato

AU - Ibi, Akira

AU - Yoshida, Ryuji

AU - Kato, Takeharu

AU - Miura, Masashi

AU - Kiss, Takanobu

AU - Inoue, Masayoshi

PY - 2019/8/1

Y1 - 2019/8/1

N2 - A new metal organic deposition (MOD) process using precursor solution containing metal trifluoroacetates was developed to improve in-field performance. In this process, the pinning centers of BaMO3 (M: metal elements such as Zr and Hf) materials could be made to be finer by reducing the once coating thickness in the coating and calcination step. This is referred to as the ultra-thin once coating (UTOC)-MOD process. This process improves the in-field performance. The UTOC-MOD process also has the advantage of uniformity of 2-dimensional Jc-distribution, which was determined using a scanning hall-probe microscopy analysis. Improvement of the Jc uniformity was also confirmed based on scribed tapes. A smaller dispersion of the filament-critical current values in the UTOC-MOD tape was determined based on a comparison with the results for obtained by a conventional process. With respect to the mechanical strength, it was established that the dispersion of the delamination strength, which was evaluated using stud-pull equipment, was suppressed. Microstructural analysis revealed that, the UTOC films were pore-free, although large pores are present in the films when conventional MOD is utilized. This difference in the microstructure can be attributed to the aforementioned improvement in the uniformity of the UTOC-MOD films.

AB - A new metal organic deposition (MOD) process using precursor solution containing metal trifluoroacetates was developed to improve in-field performance. In this process, the pinning centers of BaMO3 (M: metal elements such as Zr and Hf) materials could be made to be finer by reducing the once coating thickness in the coating and calcination step. This is referred to as the ultra-thin once coating (UTOC)-MOD process. This process improves the in-field performance. The UTOC-MOD process also has the advantage of uniformity of 2-dimensional Jc-distribution, which was determined using a scanning hall-probe microscopy analysis. Improvement of the Jc uniformity was also confirmed based on scribed tapes. A smaller dispersion of the filament-critical current values in the UTOC-MOD tape was determined based on a comparison with the results for obtained by a conventional process. With respect to the mechanical strength, it was established that the dispersion of the delamination strength, which was evaluated using stud-pull equipment, was suppressed. Microstructural analysis revealed that, the UTOC films were pore-free, although large pores are present in the films when conventional MOD is utilized. This difference in the microstructure can be attributed to the aforementioned improvement in the uniformity of the UTOC-MOD films.

UR - http://www.scopus.com/inward/record.url?scp=85065668435&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85065668435&partnerID=8YFLogxK

U2 - 10.1109/TASC.2019.2908241

DO - 10.1109/TASC.2019.2908241

M3 - Article

VL - 29

JO - IEEE Transactions on Applied Superconductivity

JF - IEEE Transactions on Applied Superconductivity

SN - 1051-8223

IS - 5

M1 - 8710275

ER -