抄録
A novel wide-band flip-chip technique is proposed, where optimized wide-gap coplanar waveguides are used to reduce the discontinuity. The flip-chip technique made it possible to achieve the return loss of over 28 dB up to 60 GHz.
| 本文言語 | 英語 |
|---|---|
| ページ | 207-209 |
| ページ数 | 3 |
| 出版ステータス | 出版済み - 12月 1 1996 |
| 外部発表 | はい |
| イベント | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA 継続期間: 10月 28 1996 → 10月 30 1996 |
その他
| その他 | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| City | Napa Valley, CA, USA |
| Period | 10/28/96 → 10/30/96 |
!!!All Science Journal Classification (ASJC) codes
- 工学（全般）