High-speed via hole filling using electrophoresis of Ag nanoparticles

Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 μm and diameter of 10 μm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10-5 [ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling.

本文言語英語
ホスト出版物のタイトル2015 International 3D Systems Integration Conference, 3DIC 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページTS5.4.1-TS5.4.4
ISBN(電子版)9781467393850
DOI
出版ステータス出版済み - 11 20 2015
イベントInternational 3D Systems Integration Conference, 3DIC 2015 - Sendai, 日本
継続期間: 8 31 20159 2 2015

出版物シリーズ

名前2015 International 3D Systems Integration Conference, 3DIC 2015

その他

その他International 3D Systems Integration Conference, 3DIC 2015
国/地域日本
CitySendai
Period8/31/159/2/15

All Science Journal Classification (ASJC) codes

  • 電子工学および電気工学

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