Hybrid integration technologies for optical micro-systems

E. Higurashi, T. Itoh, T. Suga, R. Sawada

研究成果: Contribution to journalConference article

抜粋

Flip-chip bonding of various optical components (laser diode, photodiode, grating, etc) on a silicon substrate by passive optical alignment, which eliminates complicated optical axis precise alignment, has opened up many new possibilities in constructing highly functional, reliable, and low-cost optical micro-systems. Using this technique, several micro-sensors (< 2 × 3 mm2), including a blood flow sensor that can monitor blood flow in human skin, and a high-resolution encoder that can measure displacements or revolution angles, have been developed. Moreover, for future optical micro-systems, a novel method of a low temperature flip-chip bonding using surface activated bonding process has been introduced.

元の言語英語
記事番号09
ページ(範囲)67-73
ページ数7
ジャーナルProceedings of SPIE - The International Society for Optical Engineering
5604
DOI
出版物ステータス出版済み - 12 1 2004
イベントOptomechatronic Micro/Nano Components, Devices, and Systems - Philadelphia, PA, 米国
継続期間: 10 27 200410 28 2004

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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