TY - GEN
T1 - Impact of a high pressure micro jet (HPMJ) on the conditioning and cleaning of unwoven fabric polyester pads in silicon polishing
AU - Miyachi, Keiji
AU - Seike, Yoshiyuki
AU - Haba, Shinichi
AU - Kurokawa, Syuhei
AU - Doi, Toshiro K.
N1 - Publisher Copyright:
© ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings. All rights reserved.
PY - 2007
Y1 - 2007
N2 - A novel conditioning technique using High Pressure Micro-Jet (HPMJ) with ultra pure water pressurized to 3-20 MPa was applied to unwoven fabric polyester pads to be used for silicon wafer CMP. In this study, HPMJ conditioning was compared between "no conditioning" and "brush conditioning", evaluating their performances by the removal rates, pad surface observations and SEM images. Rremoval rates of "no conditioning" and "brush conditioning" decreased due to clogging of the pad surfaces as number of polishing increased. The removal rates of HPMJ conditioning were 30 % higher than the brush conditioning when 20 wafers were polished. As a result, it has been confirmed that HPMJ is the most effective conditioning for unwoven fabric polyester pads in silicon polishing process.
AB - A novel conditioning technique using High Pressure Micro-Jet (HPMJ) with ultra pure water pressurized to 3-20 MPa was applied to unwoven fabric polyester pads to be used for silicon wafer CMP. In this study, HPMJ conditioning was compared between "no conditioning" and "brush conditioning", evaluating their performances by the removal rates, pad surface observations and SEM images. Rremoval rates of "no conditioning" and "brush conditioning" decreased due to clogging of the pad surfaces as number of polishing increased. The removal rates of HPMJ conditioning were 30 % higher than the brush conditioning when 20 wafers were polished. As a result, it has been confirmed that HPMJ is the most effective conditioning for unwoven fabric polyester pads in silicon polishing process.
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M3 - Conference contribution
AN - SCOPUS:84964411887
T3 - ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings
SP - 403
EP - 408
BT - ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings
PB - VDE Verlag GmbH
T2 - 2007 International Conference on Planarization/CMP Technology, ICPT 2007
Y2 - 25 October 2007 through 27 October 2007
ER -