Impact of a high pressure micro jet (HPMJ) on the conditioning and cleaning of unwoven fabric polyester pads in silicon polishing

Keiji Miyachi, Yoshiyuki Seike, Shinichi Haba, Syuhei Kurokawa, Toshiro K. Doi

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

3 被引用数 (Scopus)

抄録

A novel conditioning technique using High Pressure Micro-Jet (HPMJ) with ultra pure water pressurized to 3-20 MPa was applied to unwoven fabric polyester pads to be used for silicon wafer CMP. In this study, HPMJ conditioning was compared between "no conditioning" and "brush conditioning", evaluating their performances by the removal rates, pad surface observations and SEM images. Rremoval rates of "no conditioning" and "brush conditioning" decreased due to clogging of the pad surfaces as number of polishing increased. The removal rates of HPMJ conditioning were 30 % higher than the brush conditioning when 20 wafers were polished. As a result, it has been confirmed that HPMJ is the most effective conditioning for unwoven fabric polyester pads in silicon polishing process.

本文言語英語
ホスト出版物のタイトルICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings
出版社VDE Verlag GmbH
ページ403-408
ページ数6
ISBN(電子版)9783800730650
出版ステータス出版済み - 2007
イベント2007 International Conference on Planarization/CMP Technology, ICPT 2007 - Dresden, ドイツ
継続期間: 10月 25 200710月 27 2007

出版物シリーズ

名前ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings

会議

会議2007 International Conference on Planarization/CMP Technology, ICPT 2007
国/地域ドイツ
CityDresden
Period10/25/0710/27/07

!!!All Science Journal Classification (ASJC) codes

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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