In situ observation of ultrasonic flip-chip bonding using high-speed camera

Takanori Shuto, Tanemasa Asano

研究成果: Contribution to journalArticle

5 引用 (Scopus)

抜粋

Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. "Softening" of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.

元の言語英語
記事番号030204
ジャーナルJapanese Journal of Applied Physics
54
発行部数3
DOI
出版物ステータス出版済み - 3 1 2015

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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