In-situ strain measurement of ultrasonic ball bonding

Keiichiro Iwanabe, Kenichi Nakadozono, Yosuke Senda, Tanemasa Asano

研究成果: 著書/レポートタイプへの貢献会議での発言

3 引用 (Scopus)

抜粋

Dynamic change in distribution of strain generated in Si under a pad electrode was measured during ultrasonic ball bonding by using newly developed Si strain sensor. The sensor was designed to be able to determine strains in the directions normal and parallel to the surface. Bonding of Cu and Au was measured. It was clearly observed that the position of the largest compressive strain moved from the center of the ball to the periphery according to the progress of bonding under the application of the ultrasonic. Bonding of Cu was found to generate larger strain than bonding of Au. Bonding of Cu was also found to induce under-pad damage. SEM observation of bonded balls suggested that the under-pad damage appeared at the positon where the edge of the capillary existed and at the time when the large force of ultrasonic vibration was applied.

元の言語英語
ホスト出版物のタイトル2016 6th Electronic System-Integration Technology Conference, ESTC 2016
出版者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781509014026
DOI
出版物ステータス出版済み - 12 1 2016
イベント6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, フランス
継続期間: 9 13 20169 16 2016

出版物シリーズ

名前2016 6th Electronic System-Integration Technology Conference, ESTC 2016

その他

その他6th Electronic System-Integration Technology Conference, ESTC 2016
フランス
Grenoble
期間9/13/169/16/16

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Iwanabe, K., Nakadozono, K., Senda, Y., & Asano, T. (2016). In-situ strain measurement of ultrasonic ball bonding. : 2016 6th Electronic System-Integration Technology Conference, ESTC 2016 [7764689] (2016 6th Electronic System-Integration Technology Conference, ESTC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2016.7764689