Influence of bending strain on Bi-2223 tape

S. Nishimura, T. Kiss, M. Inoue, M. Ishimaru, M. Kiuchi, M. Takeo, H. Okamoto, T. Matsushita, K. Ito

研究成果: ジャーナルへの寄稿学術誌査読

5 被引用数 (Scopus)

抄録

The behavior of current-voltage (I-V) characteristics in Bi-2223 AgAgMg sheathed tape at various bending strain has been studied. The measured results were analyzed using the percolation model, and then the variation of critical current density, Jc, has been analyzed. As increasing of bending strain, Jc in the tape is reduced irreversible way. The irreversible degradation indicates that the Jc reduction is caused mainly by crack formation. However, if we extract statistic Jc distribution taking into account the cracking, it can be seen that the value of local Jc is enlarged in the remained region as the strain is increased. Namely, the pinning strength in the remained region is enlarged as the bending strain is increased. Present analysis allows us to separate the influence on grain connectivity and pinning strength originated from the strain.

本文言語英語
ページ(範囲)1001-1004
ページ数4
ジャーナルPhysica C: Superconductivity and its applications
372-376
PART 2
DOI
出版ステータス出版済み - 8月 2002

!!!All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • エネルギー工学および電力技術
  • 電子工学および電気工学

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