Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)

S. A. Belyakov, T. Nishimura, K. Sweatman, K. Nogita, C. M. Gourlay

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

3 被引用数 (Scopus)

抄録

Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.

本文言語英語
ホスト出版物のタイトル2016 International Conference on Electronics Packaging, ICEP 2016
出版社Institute of Electrical and Electronics Engineers Inc.
ページ222-225
ページ数4
ISBN(電子版)9784904090176
DOI
出版ステータス出版済み - 6 7 2016
イベント2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, 日本
継続期間: 4 20 20164 22 2016

出版物シリーズ

名前2016 International Conference on Electronics Packaging, ICEP 2016

その他

その他2016 International Conference on Electronics Packaging, ICEP 2016
国/地域日本
CityHokkaido
Period4/20/164/22/16

All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学
  • 材料力学

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