Influence of composition on the morphology of primary Cu6Sn 5 in Sn-4Cu Alloys

Stuart McDonald, Kazuhiro Nogita, Jonathan Read, Tina Ventura, Tetsuro Nishimura

研究成果: Contribution to journalArticle査読

20 被引用数 (Scopus)

抄録

Alloys from the composition range Sn-(0.7 wt.% to 7.6 wt.%)Cu consist of primary Cu6Sn5 surrounded by a eutectic Sn-Cu 6Sn5 mixture. The primary Cu6Sn5 intermetallics commonly adopt a coarse elongated morphology, which is not optimal for the mechanical properties of the soldered joint. This paper investigates the effect of trace elemental additions on the size and morphology of the primary Cu6Sn5 in Sn-4 wt.%Cu alloy with and without Ni additions. Elements investigated include ppm additions of Al, Ag, Ge, and Pb. It is shown that Al has a marked effect on the solder microstructure and refines the size of the primary Cu6Sn5, even at very low addition levels, in both binary Sn-Cu alloys and those containing additional Ni. The effect of Al is confirmed using real-time x-radiographic synchrotron observations of solidification.

本文言語英語
ページ(範囲)256-262
ページ数7
ジャーナルJournal of Electronic Materials
42
2
DOI
出版ステータス出版済み - 2 2013

All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学
  • 材料化学

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