Infrared sensor with precisely patterned Au-black absorption layer

Masaki Hirota, Shinichi Morita

研究成果: ジャーナルへの寄稿会議記事査読

18 被引用数 (Scopus)


Thermoelectric infrared sensors has been fabricated by adding to the CMOS process a surface micromachining technique and a highly accurate process for forming an infrared radiation absorbing layer. The sensor, or thermopile, consists of alternating areas of p-type and n-type polysilicon connected in series on a Si3N4 layer. An anisotropic etching technique using hydrazine is employed to form a thermally isolated membrane. While a Au-black layer for infrared radiation absorption provides the best absorption efficiency over a broad infrared wavelength region, it has been difficult to pattern the layer precisely. Patterning is accomplished by forming the Au-black layer by a low-pressure vapor deposition technique on amorphous Si and a PSG sacrificial layer and then removing it on PSG by the lift-off technique or wet etching PSG. This technique makes it possible to obtain a Au-black pattern with the same degree of accuracy as with the CMOS process. As a result, sensor performance has been improved and a device array has also been achieved. A simple sensor design method has been established by which simulations are easily conducted using a thermal equivalent circuit based on the CMOS process. Prototype sensors, having external dimensions of 160 μm×160 μm, achieved responsivity of 300, 149 and 60 V/W and a time constant of 2.0, 0.46 and 0.27 msec in the air, respectively. These performance figures surpass the performance reported to date for thermoelectric infrared sensors.

ジャーナルProceedings of SPIE - The International Society for Optical Engineering
出版ステータス出版済み - 1998
イベントProceedings of the 1998 Conference on Infrared Technology and Applications XXIV. Part 1 (of 2) - San Diego, CA, USA
継続期間: 7月 19 19987月 24 1998

!!!All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • コンピュータ サイエンスの応用
  • 応用数学
  • 電子工学および電気工学


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