Integrated micro laser doppler velocimeter with 3-D structure

Eiji Higurashi; Tadatomo Suga; Renshi Sawada

doi:10.1109/ICSENS.2010.5691000

Integrated micro laser doppler velocimeter with 3-D structure

Eiji Higurashi, Tadatomo Suga, Renshi Sawada

研究成果: Chapter in Book/Report/Conference proceeding › Conference contribution

2 被引用数 (Scopus)

抄録

Compact and thin micro laser Doppler velocimetry (LDV) sensor with 3-D structure (2.8 mm x 2.8 mm x 1 mm thick) was developed using Au-Au surface-activated bonding method (bonding temperature: 150 °C). It consists of two elements: a glass substrate with bonded photodiode chips, electrodes, and refractive microlenses; and a micromachined Si substrate with a submount, a bonded laser diode chip, micromirrors, and through-silicon vias. The feasibility of measuring velocity was demonstrated for various moving objects such as a reflective grating, an Au wire, and a light diffusing ground glass. The micro LDV sensor detected relative speeds as low as 0.4 μm/s and Doppler beat signal frequency showed good linearity to the relative velocity.

本文言語	英語
ホスト出版物のタイトル	IEEE Sensors 2010 Conference, SENSORS 2010
ページ	2409-2412
ページ数	4
DOI	https://doi.org/10.1109/ICSENS.2010.5691000
出版ステータス	出版済み - 12 1 2010
イベント	9th IEEE Sensors Conference 2010, SENSORS 2010 - Waikoloa, HI, 米国継続期間: 11 1 2010 → 11 4 2010

出版物シリーズ

名前	Proceedings of IEEE Sensors

その他

その他	9th IEEE Sensors Conference 2010, SENSORS 2010
Country	米国
City	Waikoloa, HI
Period	11/1/10 → 11/4/10

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

文献へのアクセス

10.1109/ICSENS.2010.5691000

フィンガープリント「Integrated micro laser doppler velocimeter with 3-D structure」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

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abstract = "Compact and thin micro laser Doppler velocimetry (LDV) sensor with 3-D structure (2.8 mm x 2.8 mm x 1 mm thick) was developed using Au-Au surface-activated bonding method (bonding temperature: 150 °C). It consists of two elements: a glass substrate with bonded photodiode chips, electrodes, and refractive microlenses; and a micromachined Si substrate with a submount, a bonded laser diode chip, micromirrors, and through-silicon vias. The feasibility of measuring velocity was demonstrated for various moving objects such as a reflective grating, an Au wire, and a light diffusing ground glass. The micro LDV sensor detected relative speeds as low as 0.4 μm/s and Doppler beat signal frequency showed good linearity to the relative velocity.",

author = "Eiji Higurashi and Tadatomo Suga and Renshi Sawada",

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N2 - Compact and thin micro laser Doppler velocimetry (LDV) sensor with 3-D structure (2.8 mm x 2.8 mm x 1 mm thick) was developed using Au-Au surface-activated bonding method (bonding temperature: 150 °C). It consists of two elements: a glass substrate with bonded photodiode chips, electrodes, and refractive microlenses; and a micromachined Si substrate with a submount, a bonded laser diode chip, micromirrors, and through-silicon vias. The feasibility of measuring velocity was demonstrated for various moving objects such as a reflective grating, an Au wire, and a light diffusing ground glass. The micro LDV sensor detected relative speeds as low as 0.4 μm/s and Doppler beat signal frequency showed good linearity to the relative velocity.

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