Investigation of metallic interdiffusion in Al x Ga 1-x N/GaN/sapphire heterostructures used for microelectronic devices by SEM/EDX and SIMS depth profiling

H. Téllez, J. M. Vadillo, J. J. Laserna

    研究成果: ジャーナルへの寄稿学術誌査読

    3 被引用数 (Scopus)

    抄録

    Secondary ion mass spectrometry (SIMS) depth profiling has been applied to the study of the thermal annealing of ohmic contacts for high electron mobility transistors. The metallic stacks (Ti/Al/Ni/Au) were deposited over the Al 0.28Ga0.72N/GaN/sapphire heterostructures and subjected to a rapid thermal annealing (850 °C for 30 s under N2 atmosphere) to improve the contact performance. The surface morphology and the in-depth chemical distribution of the layered contacts were severely modified due to the treatment. These modifications have been analyzed by SIMS depth profiling and scanning electron microscopy-energy-dispersive X-ray microanalysis. The SIMS analysis conditions have been optimized to achieve simultaneously good sensitivity and to avoid ion-induced mixing effects produced by the primary beam sputtering.

    本文言語英語
    ページ(範囲)2865-2871
    ページ数7
    ジャーナルAnalytical and Bioanalytical Chemistry
    397
    7
    DOI
    出版ステータス出版済み - 8月 2010

    !!!All Science Journal Classification (ASJC) codes

    • 分析化学
    • 生化学

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