Investigation of three-dimensional current distribution at silver diffusion joint of RE-123 coated conductors based on magnetic microscopy combined with finite element method

Kohei Higashikawa, Yoshihiro Honda, Masayoshi Inoue, Takanobu Kiss, Noriko Chikumoto, Naomichi Sakai, Teruo Izumi, Hiroshi Okamoto

研究成果: ジャーナルへの寄稿記事

5 引用 (Scopus)

抄録

Combining scanning Hall-probe microscopy (SHPM) with finite element method (FEM), we have investigated three-dimensional current distribution at a silver diffusion joint of RE-123 coated conductor (CC). This research aims at the understanding of electromagnetic behaviors in a jointed CC and at the establishment of an analysis model for it. Two-dimensional distribution of sheet current density in a jointed sample was visualized by a SHPM measurement with a spatial resolution of a few hundred micrometers. Then, it was found that such a distribution included information about current transfer between the jointed pieces. Furthermore, the experimental results were successfully reconstructed by a three-dimensional FEM analysis. We believe that these will be very important findings for the establishment of jointing processes on CCs and for the designs of practical applications which need such processes.

元の言語英語
記事番号5677565
ページ(範囲)3403-3407
ページ数5
ジャーナルIEEE Transactions on Applied Superconductivity
21
発行部数3 PART 3
DOI
出版物ステータス出版済み - 6 1 2011

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current distribution
Silver
Microscopic examination
finite element method
conductors
silver
microscopy
Scanning
Finite element method
scanning
probes
micrometers
Current density
spatial resolution
current density
electromagnetism

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

これを引用

Investigation of three-dimensional current distribution at silver diffusion joint of RE-123 coated conductors based on magnetic microscopy combined with finite element method. / Higashikawa, Kohei; Honda, Yoshihiro; Inoue, Masayoshi; Kiss, Takanobu; Chikumoto, Noriko; Sakai, Naomichi; Izumi, Teruo; Okamoto, Hiroshi.

:: IEEE Transactions on Applied Superconductivity, 巻 21, 番号 3 PART 3, 5677565, 01.06.2011, p. 3403-3407.

研究成果: ジャーナルへの寄稿記事

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AU - Kiss, Takanobu

AU - Chikumoto, Noriko

AU - Sakai, Naomichi

AU - Izumi, Teruo

AU - Okamoto, Hiroshi

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