Lithium niobate-on-insulator waveguide on Si substrate fabricated by room temperature bonding

R. Takigawa, K. Kamimura, K. Nakamoto, T. Asano

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

1 被引用数 (Scopus)

抄録

We have developed low-temperature bonding and surface micromachining techniques for realizing high quality lithium niobate-on-insulator (LNOI) waveguide device integrated on mature Si platform. This paper reports a fabrication of LNOI ridge waveguides on Si substrates using room-temperature bonding with Si nanoadhesive layer and ultra-precision ductile-mode cutting.

本文言語英語
ホスト出版物のタイトルProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
出版社Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743072
DOI
出版ステータス出版済み - 5 2019
イベント6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, 日本
継続期間: 5 21 20195 25 2019

出版物シリーズ

名前Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

会議

会議6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Country日本
CityKanazawa, Ishikawa
Period5/21/195/25/19

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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