TY - GEN
T1 - LNOI photonics fabricated on Si wafer by room temperature bonding
AU - Watanabe, Kaname
AU - Yamaguchi, Yuya
AU - Kanno, Atsushi
AU - Takigawa, Ryo
N1 - Funding Information:
This work was financially supported by Kakenhi Grants-mAid (JP20H02207) from the Japan Society for the Promotion of Science.
Publisher Copyright:
© 2021 IEEE
PY - 2021/10/5
Y1 - 2021/10/5
N2 - Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.
AB - Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.
UR - http://www.scopus.com/inward/record.url?scp=85120420404&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85120420404&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D53950.2021.9598368
DO - 10.1109/LTB-3D53950.2021.9598368
M3 - Conference contribution
AN - SCOPUS:85120420404
T3 - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
SP - 45
BT - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Y2 - 5 October 2021 through 11 October 2021
ER -