Local conductivity and electric field analysis of Ag-based conductive adhesive by transmission electron microscopy

N. Kawamoto, Y. Murakami, D. Shindo

研究成果: ジャーナルへの寄稿学術誌査読

6 被引用数 (Scopus)

抄録

The conduction mechanism in Ag-based conductive adhesive, which has attracted the attention of researchers, has been intensively studied by the in situ observations of transmission electron microscopy (TEM) and by using special methods that employ the use of microprobes; Ag-based conductive adhesive is considered as an alternative to Pb-free solders. A current versus voltage (I-V) curve measured by using a microscope exhibited peculiar fluctuations, which implied an irreversible change in the internal structure of a cured adhesive. TEM observations showed a local shape change in Ag agglomerations, such as the formation of small horns, in a sample that was subjected to a large electric current of 1 μA. Electron holography data, which revealed the inhomogeneous distribution of equipotential lines in the sample, also implied an essential role of morphological change in the conduction properties of Ag-based conductive adhesive.

本文言語英語
論文番号044309
ジャーナルJournal of Applied Physics
107
4
DOI
出版ステータス出版済み - 2010
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 物理学および天文学(全般)

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