Low group delay 3.1-10.6 GHz CMOS power amplifier for UWB applications

Rohana Sapawi, Ramesh Pokharel, Sohiful A.Z. Murad, Awinash Anand, Nishal Koirala, Haruichi Kanaya, K. Yoshida

研究成果: ジャーナルへの寄稿記事

27 引用 (Scopus)

抄録

This letter proposes the design of a low group delay ultra-wideband (UWB) power amplifier (PA) in 0.18μm CMOS technology. The PA design employs a three-stage cascade common source topology that has a different design concept from other multi-stage topology to provide a broad bandwidth characteristic, gain flatness of 11.48 ± 0.6dB, and low group delay variation of ± 85.8 ps. A resistive shunt feedback technique is adopted at the first stage of the amplifier to achieve good input matching, which controls the upper frequency of the UWB system. The third stage realizes the gain at the lower corner frequency and the second stage is used to smooth the flatness of the gain curve. By using this method, the proposed design has the lowest group delay variation among the recently reported CMOS PAs for 3.1 to 10.6 GHz applications.

元の言語英語
記事番号6108314
ページ(範囲)41-43
ページ数3
ジャーナルIEEE Microwave and Wireless Components Letters
22
発行部数1
DOI
出版物ステータス出版済み - 1 1 2012

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Group delay
power amplifiers
Power amplifiers
Ultra-wideband (UWB)
CMOS
flatness
broadband
topology
amplifier design
Topology
shunts
Broadband amplifiers
cascades
amplifiers
bandwidth
curves
Feedback
Bandwidth

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

これを引用

Low group delay 3.1-10.6 GHz CMOS power amplifier for UWB applications. / Sapawi, Rohana; Pokharel, Ramesh; Murad, Sohiful A.Z.; Anand, Awinash; Koirala, Nishal; Kanaya, Haruichi; Yoshida, K.

:: IEEE Microwave and Wireless Components Letters, 巻 22, 番号 1, 6108314, 01.01.2012, p. 41-43.

研究成果: ジャーナルへの寄稿記事

Sapawi, Rohana ; Pokharel, Ramesh ; Murad, Sohiful A.Z. ; Anand, Awinash ; Koirala, Nishal ; Kanaya, Haruichi ; Yoshida, K. / Low group delay 3.1-10.6 GHz CMOS power amplifier for UWB applications. :: IEEE Microwave and Wireless Components Letters. 2012 ; 巻 22, 番号 1. pp. 41-43.
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