TY - GEN
T1 - Low-loss 60 GHz patterned ground shield CPW transmission line
AU - Mat, D. A.A.
AU - Pokharel, R. K.
AU - Sapawi, R.
AU - Kanaya, H.
AU - Yoshida, K.
PY - 2011/12/1
Y1 - 2011/12/1
N2 - This paper describes the slow wave structure design below the metallization plane to reduce dielectric loss of the silicon substrates. Three types of structure, floating strips with shield strip length (SL) = shield strip spacing (SS)=10μm and 5μm, and patterned ground with SL=SS=5μm have been designed for coplanar waveguide (CPW) transmission line using 0.18μm CMOS TSMC technology. These structures act to prevent the penetration of the electric field into the silicon substrate. It shows that at frequency of 60GHz, patterned ground shield resulted lower attenuation loss, approximately 60% lower compare to conventional CPW with the increase of quality factor to 16.006. The patterned structure exhibit the attenuation loss of 0.731dB/mm. The wavelength of the design is 980μm at 60GHz.
AB - This paper describes the slow wave structure design below the metallization plane to reduce dielectric loss of the silicon substrates. Three types of structure, floating strips with shield strip length (SL) = shield strip spacing (SS)=10μm and 5μm, and patterned ground with SL=SS=5μm have been designed for coplanar waveguide (CPW) transmission line using 0.18μm CMOS TSMC technology. These structures act to prevent the penetration of the electric field into the silicon substrate. It shows that at frequency of 60GHz, patterned ground shield resulted lower attenuation loss, approximately 60% lower compare to conventional CPW with the increase of quality factor to 16.006. The patterned structure exhibit the attenuation loss of 0.731dB/mm. The wavelength of the design is 980μm at 60GHz.
UR - http://www.scopus.com/inward/record.url?scp=84856904757&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84856904757&partnerID=8YFLogxK
U2 - 10.1109/TENCON.2011.6129285
DO - 10.1109/TENCON.2011.6129285
M3 - Conference contribution
AN - SCOPUS:84856904757
SN - 9781457702556
T3 - IEEE Region 10 Annual International Conference, Proceedings/TENCON
SP - 1118
EP - 1121
BT - TENCON 2011 - 2011 IEEE Region 10 Conference
T2 - 2011 IEEE Region 10 Conference: Trends and Development in Converging Technology Towards 2020, TENCON 2011
Y2 - 21 November 2011 through 24 November 2011
ER -