Low-stress diamond-like carbon films containing carbon nanoparticles fabricated by combining rf sputtering and plasma chemical vapor deposition

Carbon nanoparticles (CNPs) incorporated diamond-like carbon (DLC) films have been fabricated by a combination of rf sputtering and plasma chemical vapor deposition. Spherical CNPs with a mean size of 21.2 nm are sandwiched between DLC layers with a mass density of 1.7 g cm-3. The film stress is decreased to 119 MPa, by depositing the CNPs over the base DLC layer at a surface coverage of 10.7%. This reduction is approximately half of that without CNPs. Raman spectroscopy indicates the insertion of CNPs barely alters the bonding structure of the upper DLC layer.