Low-temperature Au-to-Au bonding for LiNbO3/Si structure achieved in ambient air

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi

研究成果: Contribution to journalArticle査読

22 被引用数 (Scopus)

抄録

A lithium niobate (LiNbO3)/silicon (Si) hybrid structure has been developed by the surface-activated bonding of LiNbO3 chips with gold (Au) thin film to Si substrates with patterned Au film. After organic contaminants on the Au surfaces were removed using argon radio-frequency plasma, Au-to-Au bonding was carried out in ambient air. Strong bonding at significantly low temperatures below 100°C without generating cracks has been demonstrated.

本文言語英語
ページ(範囲)145-146
ページ数2
ジャーナルIEICE Transactions on Electronics
E90-C
1
DOI
出版ステータス出版済み - 1 2007
外部発表はい

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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