Low-temperature bonding of laser diode chips on Si substrates with oxygen and hydrogen atmospheric-pressure plasma activation

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

研究成果: 著書/レポートタイプへの貢献会議での発言

7 引用 (Scopus)

抜粋

Surface activated bonding (SAB) method with atmospheric-pressure plasma treatment is an effective approach to develop low cost, low damage, and low temperature bonding technology. In this research, not only conventional low-pressure plasma treatment (Ar RF plasma) but also atmospheric-pressure plasma treatment (Ar+O2, Ar+H2) was investigated for low-temperature Au-Au surface-activated bonding (150°C). In the case of Au thin film to Au thin film bonding, enough bonding strength was not obtained with Ar+O2 atmospheric-pressure plasma treatment due to Au 2O3 formed on Au surface. However, by using Au microbump (diameter at the top: 5 μm, height: 2 μm, and pitch: 10 μm), strong bonding strength was obtained with all these plasmas. Semiconductor laser diodes chips were successfully bonded to Si substrates wiht Au microbumps at low temperature (150°C) in ambient air using Ar+H2 atmospheric-pressure plasma treatment.

元の言語英語
ホスト出版物のタイトル2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
ページ475-477
ページ数3
DOI
出版物ステータス出版済み - 11 25 2009
イベント2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, 中国
継続期間: 8 10 20098 13 2009

出版物シリーズ

名前2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

その他

その他2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
中国
Beijing
期間8/10/098/13/09

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

これを引用

Takigawa, R., Higurashi, E., Suga, T., & Sawada, R. (2009). Low-temperature bonding of laser diode chips on Si substrates with oxygen and hydrogen atmospheric-pressure plasma activation. : 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 475-477). [5270708] (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009). https://doi.org/10.1109/ICEPT.2009.5270708