Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

抄録

We show that interconnection bonding of LSI chip to metallization on polyethylene naphthalate) (PEN) film can be realized by using cone-shaped compliant bump. We have investigated two designs of the counter electrode. One is simple metal pad electrode and the other is an electrode in which cross-shaped slit was formed. The bonding between the cone-shaped bump and the simple pad electrode was found to be realized at 150°C. More than 10,000 connections with about 100 mΩ/bump were formed. When the cross-shaped slit was employed, room-temperature bonding was achieved.

本文言語英語
ホスト出版物のタイトル2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOI
出版ステータス出版済み - 12月 1 2011
イベント2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, 日本
継続期間: 1月 31 20122月 2 2012

出版物シリーズ

名前2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

その他

その他2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
国/地域日本
CityOsaka
Period1/31/122/2/12

!!!All Science Journal Classification (ASJC) codes

  • 制御およびシステム工学

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