Low-temperature bonding of optical chips using coined Au stud bumps and its application to micro laser Doppler velocimeter

Michitaka Yamamoto, Takeshi Sato, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

    研究成果: Chapter in Book/Report/Conference proceedingConference contribution

    1 被引用数 (Scopus)

    抄録

    Surface activated bonding of laser diode (LD) chips on coined Au stud bumps (thickness: 10∼15 μm) with smooth surfaces (R a < 3.5 nm) was demonstrated for optical microsensor applications. Bonding of LD chips with Au thin films to the Au stud bumps on the Si substrates was performed in ambient air at low temperature (150 °C). Die-shear strength per unit area was three times as high as that obtained between Au thin films (thickness: 0.5 μm). Using this technique, compact and thin micro laser Doppler velocimeter (2.8 mm ×2.8 mm ×1 mm thick) was developed. The feasibility of measuring velocity was demonstrated for a moving Au wire (diameter: 22 μm).

    本文言語英語
    ホスト出版物のタイトルProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
    ページ数1
    DOI
    出版ステータス出版済み - 8 15 2012
    イベント2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, 日本
    継続期間: 5 22 20125 23 2012

    その他

    その他2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
    Country日本
    CityTokyo
    Period5/22/125/23/12

    All Science Journal Classification (ASJC) codes

    • Computer Graphics and Computer-Aided Design
    • Computer Vision and Pattern Recognition

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