抜粋
This paper reports the results of low-temperature flip-chip bonding of a vertical cavity surface emitting laser (VCSEL) on a micromachined Si substrate. Low temperature bonding was achieved by introducing surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au electrodes of the VCSEL and Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air. At a bonding temperature of 100°C, the die-shear strength exceeded the failure criteria of MIL-STD-883.
| 元の言語 | 英語 |
|---|---|
| ホスト出版物のタイトル | 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 |
| ページ | 121-122 |
| ページ数 | 2 |
| 巻 | 2005 |
| DOI | |
| 出版物ステータス | 出版済み - 2005 |
| イベント | 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 - Sydney, オーストラリア 継続期間: 10 22 2005 → 10 28 2005 |
その他
| その他 | 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 |
|---|---|
| 国 | オーストラリア |
| 市 | Sydney |
| 期間 | 10/22/05 → 10/28/05 |
All Science Journal Classification (ASJC) codes
- Industrial and Manufacturing Engineering
- Control and Systems Engineering
- Electrical and Electronic Engineering
フィンガープリント Low-temperature direct flip-chip bonding for integrated micro-systems' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。
これを引用
Higurashi, E., Suga, T., & Sawada, R. (2005). Low-temperature direct flip-chip bonding for integrated micro-systems. ： 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 (巻 2005, pp. 121-122). [1547908] https://doi.org/10.1109/LEOS.2005.1547908