抄録
Effects of Fe/Si ratio and growth temperature were investigated in order to realize high quality Fe<sub>3</sub>Si/Ge structures. It was found that very small <i>X</i>min values (2-3%) were achieved in a wide temperature range of 60-200°C under the stoichiometric condition. From TEM observation, it was rvealed that the Fe<sub>3</sub>Si/Ge structures with atomically flat interfaces were realized. In addition, thermal stability of the Fe<sub>3</sub>Si/Ge structures was guaranteed up to 400°C. These results suggested that growth at a low temperature (<200°C) under the stoichiometric condition was essential to obtain high quality Fe<sub>3</sub>Si/Ge structures with sharp interfaces.
本文言語 | 英語 |
---|---|
ページ(範囲) | 708-711 |
ページ数 | 4 |
ジャーナル | IEICE Transactions on Electronics |
巻 | 91 |
号 | 5 |
DOI | |
出版ステータス | 出版済み - 5月 1 2008 |