Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment

S. Yamamoto, E. Higurashi, T. Suga, Renshi Sawada

    研究成果: Chapter in Book/Report/Conference proceedingConference contribution

    2 被引用数 (Scopus)

    抄録

    For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).

    本文言語英語
    ホスト出版物のタイトル2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
    ページ1384-1387
    ページ数4
    DOI
    出版ステータス出版済み - 2011
    イベント2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, 中国
    継続期間: 6 5 20116 9 2011

    その他

    その他2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
    Country中国
    CityBeijing
    Period6/5/116/9/11

    All Science Journal Classification (ASJC) codes

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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