Maskless bumping by electroless plating for high pin count, thin, and low cost microcircuits

Koji Yamakawa, Kaoru Koiwa, Yoshimi Hisatsune, Michihiko Inaba, Nobuo Iwase

研究成果: ジャーナルへの寄稿記事

3 引用 (Scopus)

抄録

Without using a photolithographic process, a maskless bumping method has been achieved by palladium activation, nickel electroless plating, and ultrasonic soldering. A palladium chloride solution was developed for selective deposition. The average bump shear strength was 26.8 g/bump; this was maintained after 1000 hours at 150°C and after 300 thermal cycles. Nickel diffusion into the aluminum pads by 150-450°C annealing resulted in high adhesion strength and low electrical contact resistance. The bump structures were analyzed by AES (auger electron spectrometer), SIMS (secondary ion mass spectrometer), XPS (X ray photo spectrometer), and XRD (X ray diffractometer). The bumps were applied to high power transistors, LCD driver LSIs, and ASICs. Additionally, 376 pin count, 50 micrometer pitch bumps were successfully fabricated.

元の言語英語
ページ(範囲)69-84
ページ数16
ジャーナルThe International journal for hybrid microelectronics
13
発行部数3
出版物ステータス出版済み - 9 1 1990

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Electroless plating
Palladium
Spectrometers
Nickel plating
X rays
Bond strength (materials)
Soldering
Diffractometers
Mass spectrometers
Contact resistance
Application specific integrated circuits
Nickel
Aluminum
Liquid crystal displays
Shear strength
Costs
Ultrasonics
Chemical activation
Annealing
Ions

All Science Journal Classification (ASJC) codes

  • Engineering(all)

これを引用

Maskless bumping by electroless plating for high pin count, thin, and low cost microcircuits. / Yamakawa, Koji; Koiwa, Kaoru; Hisatsune, Yoshimi; Inaba, Michihiko; Iwase, Nobuo.

:: The International journal for hybrid microelectronics, 巻 13, 番号 3, 01.09.1990, p. 69-84.

研究成果: ジャーナルへの寄稿記事

Yamakawa, Koji ; Koiwa, Kaoru ; Hisatsune, Yoshimi ; Inaba, Michihiko ; Iwase, Nobuo. / Maskless bumping by electroless plating for high pin count, thin, and low cost microcircuits. :: The International journal for hybrid microelectronics. 1990 ; 巻 13, 番号 3. pp. 69-84.
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