Metal plating via electrochemical reduction of oxide layers formed by electrophoretic deposition

Kai Kamada, Naoya Enomoto, Junichi Hojo

    研究成果: ジャーナルへの寄稿学術誌査読

    3 被引用数 (Scopus)

    抄録

    A novel electroplating technique is proposed using simple and non-toxic aqueous solutions in contrast with conventional plating baths. The metal plating process consists of a two-step procedure, i.e., combination of well-known electrophoretic deposition (EPD) and electrochemical reduction. Initially, the EPD of metal oxide particles dispersed in pure water is performed so that an oxide layer can be formed on the electrode surface. The coating layer is then electrochemically reduced to the metallic state in a neutral electrolyte solution. Dissolution-precipitation of the oxide in the second step plays an important role in densification of the resultant metal film. This communication briefly discusses the electroplating mechanism and the effectiveness of the proposed technique.

    本文言語英語
    ページ(範囲)926-928
    ページ数3
    ジャーナルJournal of the Ceramic Society of Japan
    117
    1368
    DOI
    出版ステータス出版済み - 8月 2009

    !!!All Science Journal Classification (ASJC) codes

    • セラミックおよび複合材料
    • 化学 (全般)
    • 凝縮系物理学
    • 材料化学

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