Microjoining of LSI chips on poly(ethylene naphthalate) using compliant bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano

研究成果: ジャーナルへの寄稿学術誌査読

7 被引用数 (Scopus)


We show that microjoining of LSI chips on a film made of poly(ethylene naphthalate) (PEN), whose glass transition temperature is 155°C, can be realized by using a cone-shaped compliant bump for flexible electronics. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. The bonding was carried out at 150°C. More than 10,000 connections with 108 mΩ/bump were achieved. Mechanical analysis using finite element method indicates that the joining is due to deformation of the cone-shaped Au bumps.

ジャーナルJapanese journal of applied physics
6 PART 2
出版ステータス出版済み - 6月 2011

!!!All Science Journal Classification (ASJC) codes

  • 工学(全般)
  • 物理学および天文学(全般)


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