Microjoining of LSI chips on poly(ethylene naphthalate) using compliant bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano

研究成果: Contribution to journalArticle

7 引用 (Scopus)

抜粋

We show that microjoining of LSI chips on a film made of poly(ethylene naphthalate) (PEN), whose glass transition temperature is 155°C, can be realized by using a cone-shaped compliant bump for flexible electronics. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. The bonding was carried out at 150°C. More than 10,000 connections with 108 mΩ/bump were achieved. Mechanical analysis using finite element method indicates that the joining is due to deformation of the cone-shaped Au bumps.

元の言語英語
記事番号06GM05
ジャーナルJapanese journal of applied physics
50
発行部数6 PART 2
DOI
出版物ステータス出版済み - 6 1 2011

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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  • これを引用

    Shuto, T., Watanabe, N., Ikeda, A., Higashimachi, T., & Asano, T. (2011). Microjoining of LSI chips on poly(ethylene naphthalate) using compliant bump. Japanese journal of applied physics, 50(6 PART 2), [06GM05]. https://doi.org/10.1143/JJAP.50.06GM05