Microstructure control in Sn-0.7 mass% Cu alloys

Kazuhiro Nogita, Jonathan Read, Tetsuro Nishimura, Keith Sweatman, Shoichi Suenaga, Arne K. Dahle

研究成果: ジャーナルへの寄稿学術誌査読

47 被引用数 (Scopus)

抄録

Soldering alloys based on the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging from 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples and samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic and that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.

本文言語英語
ページ(範囲)2419-2425
ページ数7
ジャーナルMaterials Transactions
46
11
DOI
出版ステータス出版済み - 11月 2005

!!!All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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