Microwave assisted spin transfer torque switching in a vertically integrated logic-in-memory architecture

H. Yu, X. Ya, T. Tanaka, Kimihide Matsuyama

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

抄録

Current information devices will be confronted with a serious physical limit in the lateral downsizing in the future. An alternative approach for continuous progress in the device performance is intensively demanded. An integration of multi functionality, such as memory and logic components, is a promising solution for an increasing requirement in various system applications [1,2]. In the present study, an exchange coupled multilayer stack, was proposed as a quarterly state logic-in-memory structure, and fundamental device operations have been numerically demonstrated with micromagnetic simulations.

本文言語英語
ホスト出版物のタイトル2015 IEEE International Magnetics Conference, INTERMAG 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781479973224
DOI
出版ステータス出版済み - 1月 1 2015
イベント2015 IEEE International Magnetics Conference, INTERMAG 2015 - Beijing, 中国
継続期間: 5月 11 20155月 15 2015

その他

その他2015 IEEE International Magnetics Conference, INTERMAG 2015
国/地域中国
CityBeijing
Period5/11/155/15/15

!!!All Science Journal Classification (ASJC) codes

  • 表面、皮膜および薄膜
  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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