Mode I fracture modeling of elastomer toughened epoxy adhesive joints

M. Todo, S. K. Chaturvedi, R. L. Sierakowski

研究成果: Contribution to journalArticle査読

3 被引用数 (Scopus)

抄録

An analytical model is developed to correlate the mode I fracture energy of toughened epoxy adhesive joints with microdamage mechanisms generated around a crack tip. The analytical expression for the mode I fracture energy is derived on the basis of total energy dissipation during crack extension. Three dominant damage modes, plastic shear band formation, plastic void growth, and plastic deformation of the entire matrix resin in a crack-tip region, are identified in the proposed model as the primary energy dissipation mechanisms. Numerical results show that the model can predict the effects of adhesive thickness on the mode I fracture energy of toughened adhesive joints. The analytical model involving material constants and micro structural variables should provide some guidelines toward achieving optimum fracture toughness for these types of adhesive joints.

本文言語英語
ページ(範囲)301-312
ページ数12
ジャーナルInternational Journal of Fracture
85
4
DOI
出版ステータス出版済み - 1997

All Science Journal Classification (ASJC) codes

  • Computational Mechanics
  • Modelling and Simulation
  • Mechanics of Materials

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