TY - GEN
T1 - Modeling and numerical analysis of thermal treatment of granulated porous particles by induction plasma
AU - Hossain, M. Mofazzal
AU - Yao, Y.
AU - Alam, M. Rafiqul
AU - Alam, M. Maksud
AU - Watanabe, T.
PY - 2008/12/1
Y1 - 2008/12/1
N2 - In this paper it is aimed to describe the modeling and numerical analysis of thermal treatment of granulated porous particles by induction plasma. To investigate the heat exchange dynamics between plasma and particles during the flight of granulated porous particles through the hot plasma, a plasma-particle interactive flow model has been developed. This model solves the conservation equations to predict the temperature and flow fields of plasma, under local thermal equilibrium (LTE) conditions, and then computes the injected particles trajectories, temperature and size histories, and the particle source terms to incorporate the particle loading effects. It is found that the size and dose of injected particles greatly affect the particle trajectory and temperature, and hence the heat transfer to particles at higher powder feed-rate.
AB - In this paper it is aimed to describe the modeling and numerical analysis of thermal treatment of granulated porous particles by induction plasma. To investigate the heat exchange dynamics between plasma and particles during the flight of granulated porous particles through the hot plasma, a plasma-particle interactive flow model has been developed. This model solves the conservation equations to predict the temperature and flow fields of plasma, under local thermal equilibrium (LTE) conditions, and then computes the injected particles trajectories, temperature and size histories, and the particle source terms to incorporate the particle loading effects. It is found that the size and dose of injected particles greatly affect the particle trajectory and temperature, and hence the heat transfer to particles at higher powder feed-rate.
UR - http://www.scopus.com/inward/record.url?scp=63449099510&partnerID=8YFLogxK
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U2 - 10.1109/ICECE.2008.4769325
DO - 10.1109/ICECE.2008.4769325
M3 - Conference contribution
AN - SCOPUS:63449099510
SN - 9781424420155
T3 - Proceedings of ICECE 2008 - 5th International Conference on Electrical and Computer Engineering
SP - 827
EP - 832
BT - Proceedings of ICECE 2008 - 5th International Conference on Electrical and Computer Engineering
T2 - 5th International Conference on Electrical and Computer Engineering, ICECE 2008
Y2 - 20 December 2008 through 22 December 2008
ER -