Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface

Hideaki Tsukamoto, Zigang Dong, Han Huang, Tetsuro Nishimura, Kazuhiro Nogita

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

1 引用 (Scopus)

抜粋

The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn 5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062×10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.

元の言語英語
ホスト出版物のタイトルPRICM7
ページ2446-2449
ページ数4
DOI
出版物ステータス出版済み - 8 17 2010
イベント7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 - Cairns, QLD, オーストラリア
継続期間: 8 2 20108 6 2010

出版物シリーズ

名前Materials Science Forum
654-656
ISSN(印刷物)0255-5476

その他

その他7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7
オーストラリア
Cairns, QLD
期間8/2/108/6/10

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • これを引用

    Tsukamoto, H., Dong, Z., Huang, H., Nishimura, T., & Nogita, K. (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. : PRICM7 (pp. 2446-2449). (Materials Science Forum; 巻数 654-656). https://doi.org/10.4028/www.scientific.net/MSF.654-656.2446