抄録
Micro-designed multilayer interlayers have been used to join both oxide and non-oxide ceramics. The approach allows the formation of ceramic-ceramic joints with high melting point metals at temperatures that are typically several hundred degrees lower than those required for more conventional joining methods. The new joining approach employs a thin transient liquid phase (TLP) layer to allow joining by a brazing-like process. Several distinct interlayers have been used to join alumina ceramics successfully; work using Ni-based interlayers has demonstrated the potentially beneficial impact of "reactive" metal additions to the TLP. The method has also been applied to the joining of silicon-based ceramics, and has led to the fabrication of joints with reproducibly high strengths.
本文言語 | 英語 |
---|---|
ページ(範囲) | 313-322 |
ページ数 | 10 |
ジャーナル | Ceramics International |
巻 | 23 |
号 | 4 |
DOI | |
出版ステータス | 出版済み - 1997 |
外部発表 | はい |
!!!All Science Journal Classification (ASJC) codes
- 電子材料、光学材料、および磁性材料
- セラミックおよび複合材料
- プロセス化学およびプロセス工学
- 表面、皮膜および薄膜
- 材料化学