New approaches to joining ceramics for high-temperature applications

M. R. Locatelli, B. J. Dalgleish, K. Nakashima, A. P. Tomsia, A. M. Glaeser

研究成果: ジャーナルへの寄稿学術誌査読

81 被引用数 (Scopus)

抄録

Micro-designed multilayer interlayers have been used to join both oxide and non-oxide ceramics. The approach allows the formation of ceramic-ceramic joints with high melting point metals at temperatures that are typically several hundred degrees lower than those required for more conventional joining methods. The new joining approach employs a thin transient liquid phase (TLP) layer to allow joining by a brazing-like process. Several distinct interlayers have been used to join alumina ceramics successfully; work using Ni-based interlayers has demonstrated the potentially beneficial impact of "reactive" metal additions to the TLP. The method has also been applied to the joining of silicon-based ceramics, and has led to the fabrication of joints with reproducibly high strengths.

本文言語英語
ページ(範囲)313-322
ページ数10
ジャーナルCeramics International
23
4
DOI
出版ステータス出版済み - 1997
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • セラミックおよび複合材料
  • プロセス化学およびプロセス工学
  • 表面、皮膜および薄膜
  • 材料化学

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