New module structure using flip-chip technology for high-speed optical communication ICs

Satoshi Yamaguchi; Yuhki Imai; Shunji Kimura; Hideki Tsunetsugu

New module structure using flip-chip technology for high-speed optical communication ICs

Satoshi Yamaguchi, Yuhki Imai, Shunji Kimura, Hideki Tsunetsugu

研究成果: ジャーナルへの寄稿 › 会議記事 › 査読

抄録

This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

本文言語	英語
ページ（範囲）	243-246
ページ数	4
ジャーナル	IEEE MTT-S International Microwave Symposium Digest
巻	1
出版ステータス	出版済み - 1月 1 1996
外部発表	はい
イベント	Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA 継続期間: 6月 17 1996 → 6月 21 1996

!!!All Science Journal Classification (ASJC) codes

放射線
凝縮系物理学
電子工学および電気工学

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title = "New module structure using flip-chip technology for high-speed optical communication ICs",

abstract = "This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.",

author = "Satoshi Yamaguchi and Yuhki Imai and Shunji Kimura and Hideki Tsunetsugu",

year = "1996",

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AU - Imai, Yuhki

AU - Kimura, Shunji

AU - Tsunetsugu, Hideki

PY - 1996/1/1

Y1 - 1996/1/1

N2 - This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

AB - This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

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T2 - Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3)

Y2 - 17 June 1996 through 21 June 1996

ER -

New module structure using flip-chip technology for high-speed optical communication ICs

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!!!All Science Journal Classification (ASJC) codes

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