Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Guang Zeng, Stuart D. McDonald, Dekui Mu, Yasuko Terada, Hideyuki Yasuda, Qinfen Gu, Kazuhiro Nogita

研究成果: Contribution to journalArticle査読

19 被引用数 (Scopus)

抄録

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu BGA solder joints was investigated by using synchrotron micro X-ray fluorescence (XRF) analysis and synchrotron X-ray diffraction (XRD). Compared to Sn-0.7Cu/Cu BGA joints, Ni containing solder show suppressed Cu3Sn growth in both reflow and annealed conditions. In as-reflowed Sn-0.7Cu-0.05Ni/Cu BGA joints, Ni was relatively homogenously distributed within interfacial (Cu,Ni)6Sn5. During subsequent annealing, the diffusion of Ni in Cu6Sn5 was limited and it remained concentrated adjacent the Cu substrate where it contributes to the suppression of Cu3Sn formation at the interface between the Cu substrate and Cu6Sn5 intermetallics.

本文言語英語
ページ(範囲)20-27
ページ数8
ジャーナルIntermetallics
54
DOI
出版ステータス出版済み - 11 2014

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

フィンガープリント 「Ni segregation in the interfacial (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

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