Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: Short review

M. M.A. Mohd Salleh, Stuart Mcdonald, Kazuhiro Nogita

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

25 被引用数 (Scopus)

抄録

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that by additions of nonmetal reinforcement from micron up to nano particle size had suppressed the intermetallic compound formations of lead-free composite solders.

本文言語英語
ホスト出版物のタイトルInformation Technology for Manufacturing Systems IV
ページ260-266
ページ数7
DOI
出版ステータス出版済み - 10 29 2013
イベント4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013 - Auckland, ニュージ―ランド
継続期間: 8 28 20138 29 2013

出版物シリーズ

名前Applied Mechanics and Materials
421
ISSN(印刷版)1660-9336
ISSN(電子版)1662-7482

その他

その他4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013
Countryニュージ―ランド
CityAuckland
Period8/28/138/29/13

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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