We report herein fabrication of arrays of 20 nm silica wall with high aspect ratio via photolithography and the surface sol-gel process. The photolithographycally-fabricated line template on silicon wafer was coated with silica nanolayer by the surface sol-gel process, and the topmost portion of the silica layer and the template was successively removed by CHF3 and oxygen plasma treatment in this order to leave the sidewall of the silica layer on the substrate. The width of as-prepared wall depended on the cycle of the surface sol-gel process, and the thickness of silica wall was only 8 nm at 30 cycles. The height/width ratio of the wall is surprisingly high compared to that of the current lithography processes. The reported method is simple, practical and cost-efficient, and it opens a gateway to further miniaturization of nanostructures.
|出版ステータス||出版済み - 2006|
|イベント||55th SPSJ Annual Meeting - Nagoya, 日本|
継続期間: 5 24 2006 → 5 26 2006
|その他||55th SPSJ Annual Meeting|
|Period||5/24/06 → 5/26/06|
All Science Journal Classification (ASJC) codes