On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector

Yu Yamashita, Keita Ichikawa, Natsumi Basaki, Shinya Sakuma, Yoko Yamanishi

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.

本文言語英語
ホスト出版物のタイトル34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
出版社Institute of Electrical and Electronics Engineers Inc.
ページ678-680
ページ数3
ISBN(電子版)9781665419123
DOI
出版ステータス出版済み - 1 25 2021
イベント34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, 米国
継続期間: 1 25 20211 29 2021

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2021-January
ISSN(印刷版)1084-6999

会議

会議34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
国/地域米国
CityVirtual, Gainesville
Period1/25/211/29/21

All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 機械工学
  • 電子工学および電気工学

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