TY - GEN
T1 - One-sided directional slot antenna with magnetic film for 28 GHz application
AU - Miyahara, Koto
AU - Ishibashi, Takeshi
AU - Tham, Kim Kong
AU - Goodwill, Kumar
AU - Kanaya, Haruichi
N1 - Funding Information:
This work was partially supported by the Cabinet Office (CAO), Cross ministerial Strategic Innovation Promotion Program (SIP), "An intelligent knowledge processing infrastructure, integrating physical and virtual domains" (fnnding agency: NEDO) JPNP 1 80 1 4, NICTI5G 02801, and KAKENHI (2 1K04 1 77, JP20H00253) JSPS. The authors would like to express thanks to K2. Inc., Japan, for their helpful support for the fabrication.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper presents the design of a one-sided directional slot antenna for 28GHz application. The antenna element is composed of a top metal, a dielectric substrate, and a bottom metal layer. The antenna is connected by the coplanar waveguide to the feed line. In order to suppress the back-side radiation and improve the front to back (F/B) ratio, the magnetic film is attached to the back side of the antenna. The measured gain of the antenna with the magnetic film is 5.32 dBi at 30.7 GHz, and the F/B ratio is 11.5 dB.
AB - This paper presents the design of a one-sided directional slot antenna for 28GHz application. The antenna element is composed of a top metal, a dielectric substrate, and a bottom metal layer. The antenna is connected by the coplanar waveguide to the feed line. In order to suppress the back-side radiation and improve the front to back (F/B) ratio, the magnetic film is attached to the back side of the antenna. The measured gain of the antenna with the magnetic film is 5.32 dBi at 30.7 GHz, and the F/B ratio is 11.5 dB.
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U2 - 10.1109/EPTC56328.2022.10013140
DO - 10.1109/EPTC56328.2022.10013140
M3 - Conference contribution
AN - SCOPUS:85147437111
T3 - Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022
SP - 325
EP - 328
BT - Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th Electronics Packaging Technology Conference, EPTC 2022
Y2 - 7 December 2022 through 9 December 2022
ER -