Optical micro sensors integration and application

Nobutomo Morita, Renshi Sawada

    研究成果: Chapter in Book/Report/Conference proceedingConference contribution

    1 被引用数 (Scopus)

    抄録

    Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

    本文言語英語
    ホスト出版物のタイトルIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium
    ホスト出版物のサブタイトル"Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ3-6
    ページ数4
    ISBN(電子版)9781479961955
    DOI
    出版ステータス出版済み - 1 13 2015
    イベント2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto, 日本
    継続期間: 11 4 201411 6 2014

    出版物シリーズ

    名前IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

    その他

    その他2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
    国/地域日本
    CityKyoto
    Period11/4/1411/6/14

    All Science Journal Classification (ASJC) codes

    • 電子工学および電気工学

    フィンガープリント

    「Optical micro sensors integration and application」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

    引用スタイル