Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards

H. Sugahara, S. Kimura, K. Murata, E. Sano

研究成果: Contribution to conferencePaper査読

3 被引用数 (Scopus)

抄録

The development of a key technology for realizing small, low-cost integrated circuits (IC) modules for over-40-Gb/s optical communication systems was described. The technology mainly featured four-layer resin printed circuit boards (PCB) and 8-mm-square leadless chip carriers (LCC). Application of this technology was to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.

本文言語英語
ページ255-258
ページ数4
出版ステータス出版済み - 1 1 2001
外部発表はい
イベント23rd Annual GaAs IC Symposium 2001 - Baltimore, MD, 米国
継続期間: 10 21 200110 24 2001

会議

会議23rd Annual GaAs IC Symposium 2001
Country米国
CityBaltimore, MD
Period10/21/0110/24/01

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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