Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications

Selena Smith, Guang Zeng, Jonathan Read, Stuart D. McDonald, Kazuhiro Nogita

研究成果: 著書/レポートタイプへの貢献会議での発言

3 引用 (Scopus)

抜粋

Extending the use of the Sn-Cu system to high-temperature solders poses additional challenges as the necessary high Cu content is in a region of the binary phase diagram which is dominated by the peritectic reaction and has the intermetallic compound (IMC) Cu3Sn as the primary phase, which is known to have negative effects on soldering properties. Minor additions of nickel (Ni) have been reported to suppress the formation of Cu3Sn in low Cu content Sn-Cu solder alloys though higher Cu content alloys have not been investigated. As such, the objective of this paper was to investigate the effect of more significant concentrations of Ni on the microstructure of a Sn-30wt%Cu alloy. An initial addition of 2wt%Ni greatly reduced the volume fractions of Cu3Sn and the amount of eutectic present whilst significantly increasing the volume fraction of Cu6Sn5; however, further additions of Ni had a less pronounced affect. The Sn-30wt%Cu morphology was changed from a plate-like structure to a dendritic structure by adding Ni, which would improve solder performance by decreasing the possible crack plane length.

元の言語英語
ホスト出版物のタイトルAdvanced Materials Engineering and Technology IV
編集者Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
出版者Trans Tech Publications Ltd
ページ58-62
ページ数5
ISBN(印刷物)9783035710205
DOI
出版物ステータス出版済み - 1 1 2016
イベントInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, 台湾省、中華民国
継続期間: 12 4 201512 5 2015

出版物シリーズ

名前Materials Science Forum
857
ISSN(印刷物)0255-5476

その他

その他International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
台湾省、中華民国
Kaohsiung
期間12/4/1512/5/15

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

これを引用

Smith, S., Zeng, G., Read, J., McDonald, S. D., & Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. : M. M. Al Bakri Abdullah, R. A. Razak, M. F. M. Tahir, M. M. Al Bakri Abdullah, R. A. Razak, & L. Jamaludin (版), Advanced Materials Engineering and Technology IV (pp. 58-62). (Materials Science Forum; 巻数 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.58