抄録
As the development of flexible materials and advanced materials progresses, innovative wiring methods for these materials are attracting attention. In this study, we investigated a new wiring technology using plasma-induced microbubbles for elastomer without any surface treatment. Our technology includes three main points. (1) Unlike electroless plating and other conventional methods, it does not require complicated pre-surface treatment processes before wiring. (2) A wiring resolution of 500 micro meter can be reached quickly and economically. (3) Robust metallic adhesion on a wide range of materials can be successfully carried out with precise positioning. Here, by applying our method, we adhered nickel nanoparticles to a latex rubber substrate and demonstrated the electrical conductivity of the created line. The result suggests that our method has potential as an innovative wiring technology to precisely, robustly, and simply fabricate an electric circuit without any complicated procedures or pre-treatment. Our method can contribute to microfabrication technologies.
| 元の言語 | 英語 |
|---|---|
| 記事番号 | 389 |
| ジャーナル | Micromachines |
| 巻 | 10 |
| 発行部数 | 6 |
| DOI | |
| 出版物ステータス | 出版済み - 6 1 2019 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering
これを引用
Plasma-induced bubble microjet metallization of elastomer. / Ichikawa, Keita; Basaki, Natsumi; Yamashita, Yu; Yamanishi, Yoko.
：: Micromachines, 巻 10, 番号 6, 389, 01.06.2019.研究成果: ジャーナルへの寄稿 › 記事
}
TY - JOUR
T1 - Plasma-induced bubble microjet metallization of elastomer
AU - Ichikawa, Keita
AU - Basaki, Natsumi
AU - Yamashita, Yu
AU - Yamanishi, Yoko
PY - 2019/6/1
Y1 - 2019/6/1
N2 - As the development of flexible materials and advanced materials progresses, innovative wiring methods for these materials are attracting attention. In this study, we investigated a new wiring technology using plasma-induced microbubbles for elastomer without any surface treatment. Our technology includes three main points. (1) Unlike electroless plating and other conventional methods, it does not require complicated pre-surface treatment processes before wiring. (2) A wiring resolution of 500 micro meter can be reached quickly and economically. (3) Robust metallic adhesion on a wide range of materials can be successfully carried out with precise positioning. Here, by applying our method, we adhered nickel nanoparticles to a latex rubber substrate and demonstrated the electrical conductivity of the created line. The result suggests that our method has potential as an innovative wiring technology to precisely, robustly, and simply fabricate an electric circuit without any complicated procedures or pre-treatment. Our method can contribute to microfabrication technologies.
AB - As the development of flexible materials and advanced materials progresses, innovative wiring methods for these materials are attracting attention. In this study, we investigated a new wiring technology using plasma-induced microbubbles for elastomer without any surface treatment. Our technology includes three main points. (1) Unlike electroless plating and other conventional methods, it does not require complicated pre-surface treatment processes before wiring. (2) A wiring resolution of 500 micro meter can be reached quickly and economically. (3) Robust metallic adhesion on a wide range of materials can be successfully carried out with precise positioning. Here, by applying our method, we adhered nickel nanoparticles to a latex rubber substrate and demonstrated the electrical conductivity of the created line. The result suggests that our method has potential as an innovative wiring technology to precisely, robustly, and simply fabricate an electric circuit without any complicated procedures or pre-treatment. Our method can contribute to microfabrication technologies.
UR - http://www.scopus.com/inward/record.url?scp=85068837065&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068837065&partnerID=8YFLogxK
U2 - 10.3390/mi10060389
DO - 10.3390/mi10060389
M3 - Article
AN - SCOPUS:85068837065
VL - 10
JO - Micromachines
JF - Micromachines
SN - 2072-666X
IS - 6
M1 - 389
ER -