Plastic deformation behavior of electroformed copper liner of shaped charge at different strain rates

H. Y. Gao, W. H. Tian, A. L. Fan, Q. Sun

研究成果: Contribution to journalArticle査読

抄録

The paper deals with different plastic deformation behavior of electroformed copper liner of shaped charge, deformed at high strain rate (about 1×l07 s-1) and normal strain rate (4×l0-4 s-1). The crystallographic orientation distribution of grains in recovered slugs which had undergone high-strain-rate plastic deformation during explosive detonation was investigated by electron backscattering Kikuchi pattern technique. Cellular structures formed by tangled dislocations and sub-grain boundaries consisting of dislocation arrays were detected in the recovered slugs. Some twins and slip dislocations were observed in specimen deformed at normal strain rate. It was found that dynamic recovery and recrystallization take place during high-strain-rate deformation due to the temperature rising, whereas the conventional slip mechanism operates during deformation at normal strain rate.

本文言語英語
ページ(範囲)72-77
ページ数6
ジャーナルActa Metallurgica Sinica (English Letters)
16
1
出版ステータス出版済み - 2 2003
外部発表はい

All Science Journal Classification (ASJC) codes

  • 金属および合金
  • 産業および生産工学

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