Polishing characteristics of glass substrate using new atmosphere control sealed CMP machine (Bell-jar shaped CMP machine) - Effect of Bell-jar processing that aims at reduce of amount of CeO2 slurry use

Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Yoji Umezaki, Tao Yin, Hideo Aida

研究成果: Contribution to journalArticle査読

抄録

Aiming to achieve highly effective polishing in the super-precision polishing of the glass substrate using for HDD, we have conducted a research examining polishing characteristics of the glass substrate cerium oxide and manganese oxide slurries, and a newly devised atmosphere control sealed CMP machine (Bell-jar shaped CMP chamber). Polishing experiment was carried in a radical environment by making the polishing chamber vacuum, or highly pressurized charging various gases inside. Polishing rates varied as the polishing environment varied. When compared with the conventional CMP, the polishing rate increased from 1.5 to 2.0 times. The above result suggests the effectiveness of the glass polishing in the pressurized chamber utilizing the atmosphere control sealed CMP machine. Furthermore this allows the polishing time shortened, leading to the reduction of slurry consumption.

本文言語英語
ページ(範囲)149-154
ページ数6
ジャーナルSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
78
2
DOI
出版ステータス出版済み - 2 2012

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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