Polishing mechanism of glass substrates with its processing characteristics by cerium oxide and manganese oxide slurries

T. Yamazaki, T. K. Doi, Syuhei Kurokawa, S. Isayama, Y. Umezaki, Y. Matsukawa, H. Kono, Y. Akagami, Y. Yamaguchi, Y. Kawase

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

3 被引用数 (Scopus)

抄録

With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn 2O3 abrasives potential to replace disappearing CeO 2 for the polishing of glass substrates.

本文言語英語
ホスト出版物のタイトルAdvances in Precision Engineering
ページ141-145
ページ数5
DOI
出版ステータス出版済み - 12 29 2010
イベントICoPE2010 and 13th ICPE International Conference on Precision Engineering - , シンガポール
継続期間: 7 28 20107 30 2010

出版物シリーズ

名前Key Engineering Materials
447 448
ISSN(印刷版)1013-9826

その他

その他ICoPE2010 and 13th ICPE International Conference on Precision Engineering
Countryシンガポール
Period7/28/107/30/10

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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